Coating for Cleaning Processes in Semiconductor Manufacturing Equipment
Corrosion prevention, prevention of metal ion leaching, and prevention of wafer scratches. Summarizing and solving the challenges of cleaning equipment.
In the cleaning process of semiconductor manufacturing, the use of various chemical solutions poses serious challenges such as corrosion of equipment parts and the leaching of metal ions. By applying fluororesin coating to moving parts, chemical resistance is provided, preventing corrosion. The application in cleaning tanks helps suppress the leaching of metal ions, maintaining a high-purity cleaning process. Furthermore, the application to the wafer stage can also address the prevention of wafer scratches. Yoshida SKT, as a pioneer in Teflon(TM) coating, has extensive experience in the semiconductor field and excels in customizing solutions according to customer equipment specifications and chemical conditions. For detailed technical information and case studies, please download the materials for review.
- Company：吉田ＳＫＴ
- Price：Other
